Processes for forming dental materials and device

ABSTRACT

Processes for forming dental materials that include applying a first hardenable dental composition (e.g., a dental adhesive) to a surface followed by applying a second hardenable dental composition (e.g., a dental composite) to the first hardenable dental composition on the surface. The first and second hardenable dental compositions are hardened such that the second hardenable composition is substantially completely hardened prior to complete hardening of the first hardenable composition.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. Ser. No. 10/185,431, filed Jun.28, 2002, now U.S. Pat. No. 7,134,875, the disclosure of which isincorporated by reference in its entirety herein.

TECHNICAL FIELD

This invention relates to processes for forming dental materials fromhardenable dental compositions involving generally sequential hardening.

BACKGROUND

Hardenable polymeric materials are used in a wide variety of dentalapplications, including composites, filling materials, restoratives,cements, adhesives, and the like. Often, such materials shrink uponhardening. This is particularly problematic when the material is in aconstrained environment, as in a dental filling or restorative, forexample. Dimensional changes upon shrinkage while in a constrainedenvironment can generate a strain within the material that is typicallyconverted into a stress on the surrounding environment (e.g., tooth).Such forces can result in interfacial failures between the tooth and thepolymeric material resulting in a physical gap and subsequentmicroleakage into the tooth cavity. Alternatively, such forces can leadto fractures within the tooth and/or the composite.

Generally, conventional processes of hardening polymeric dentalmaterials involve a composite held in place on an oral surface with anadhesive and involve hardening the adhesive and then subsequentlyhardening the composite material. More specifically, conventionalmethods utilize one or more of the following steps: surface treatment ofthe tooth (e.g., etching, priming), application of a hardenable adhesiveto the tooth surface, curing of the adhesive, placement of a compositematerial (e.g., restorative) on the hardened adhesive, and curing of thecomposite material. Such methods also typically utilize a blue lightsource emitting between approximately 380 nm to 520 nm to inducehardening. Photocurable dental compositions are preferably polymerizedwithin a range of about 380 nm to 520 nm for the following reasons: 1)photoactivation utilizing UV photoinitiators or sensitizers (such asbenzoin alkyl ethers, acetophenone derivatives, benzophenone and thelike) that absorb light at wavelengths less than about 380 nm aregenerally considered to be unsafe due to the shortwavelength radiation;2) photoinitiators or photosensitizers (such as eosin dyes, rose bengal,methylene blue and the like) that absorb light at wavelengths greaterthan about 520 nm are generally unsuitable due to their highly colorednature (red to blue in color) in a spectral region which is estheticallyunsuitable for teeth which are generally white to slightly yellow. 3)the preferred sensitizers and initiators for dental compositions whichabsorb blue light between about 380 nm to 520 nm are typically paleyellow to yellow in color which provides clinically acceptable materialsin terms of the esthetics of the hard tissues. Therefore, the practicallimitations described have led to nearly exclusive usage of blue light.Thus, there is a need for methods of hardening dental materials, e.g.,dental adhesives and dental composites, that reduce the amount of stressplaced on the dental material and the surrounding environment during orafter hardening.

SUMMARY OF THE INVENTION

The present invention provides processes for hardening (e.g., curing bypolymerization, crosslinking, ionic reaction, or other chemicalreaction) hardenable compositions involving a generally sequentialhardening of the compositions. Such processes are particularly useful indental applications, such as dental sealants, dental adhesives, dentalcements, dental composites, dental restoratives, and dental prostheses,for example. The processes of the present invention typically result ina reduction in the amount of stress placed on the dental material andsurrounding environment during and/or after hardening of the material.

Generally, the processes of the present invention involve a first stepof initiating hardening of a second composition that is in contact witha first composition that is in contact with a dental surface (e.g.,tooth surface or bone). Subsequently, either while the secondcomposition is hardening (e.g., polymerizing) or after it issubstantially completely hardened, the processes involve a second stepof initiating hardening of the first composition. Typically, thehardening steps can be carried out through a chemical curing mechanismor a photopolymerization mechanism, for example.

In one embodiment, the present invention provides a process for forminga dental material adhered to a surface that includes: applying a firsthardenable dental composition to the surface, wherein the firsthardenable composition includes a first photoinitiator that absorbsradiation within a range of about 380 nm to about 520 nm (blue light);applying a second hardenable dental composition to the first hardenablecomposition on the surface, wherein the second hardenable compositionincludes a second photoinitiator that absorbs radiation within a rangeof about 380 nm to about 520 nm; irradiating the second hardenablecomposition with radiation within a range of about 380 nm to about 520nm to selectively harden the second composition; and subsequentlyirradiating the first hardenable composition with radiation within arange of about 380 nm to about 520 nm to harden the first compositionand adhere the second composition to the surface; wherein neither thefirst photoinitiator nor the second photoinitiator absorbs radiationabove about 520 nm. As used herein, “selectively harden” means that thesecond composition is hardened while the first composition remainssubstantially unhardened.

In certain embodiments, the first hardenable composition is a dentaladhesive and the second hardenable composition is a dental composite. Incertain embodiments, the surface is an oral surface, typically a surfaceof a tooth or bone. In certain embodiments, the first photoinitiator isa phosphine oxide and the second photoinitiator is a diketone. Preferredphosphine oxides are acyl and bisacyl phosphine oxides, with the morepreferred being bisacyl phosphine oxides. The photoinitiators of thisinvention preferably absorb light between about 380 to about 520 nm andare either nearly colorless, pale yellow, or yellow in coloration.

Examples of phosphine oxides include the acyl phosphine oxides of theformula:(R¹)₂P(═O)C(═O)R²wherein: each R¹ is individually a hydrocarbyl group, wherein optionallytwo R¹ groups can be joined to form a ring along with the phosphorousatom; and each R² is independently a hydrocarbyl group, an S—, O—, orN-containing five- or six-membered heterocyclic group, or a-Z-C(═O)P(═O)(R¹)₂ group, wherein Z represents a divalent hydrocarbylgroup.

Examples of phosphine oxides also include the bisacyl phosphine oxidesof the formula:R¹P(═O)(C(═O)R²)₂wherein: R¹ is a hydrocarbyl group; and each R² is independently ahydrocarbyl group, an S—, O—, or N-containing five- or six-memberedheterocyclic group.

In another embodiment, a process for forming a dental material adheredto an oral surface includes: applying a hardenable dental adhesive to anoral surface, wherein the hardenable adhesive includes a firstphotoinitiator that absorbs radiation within a range of about 380 nm toabout 450 nm; applying a hardenable dental composite to the hardenabledental adhesive on the oral surface, wherein the hardenable dentalcomposite includes a second photoinitiator that absorbs radiation withina range of about 450 nm to about 520 nm; irradiating the hardenabledental composite with radiation within a range of about 450 nm to about520 nm to selectively harden the hardenable dental composite; andsubsequently irradiating the hardenable dental adhesive with radiationwithin a range of about 380 nm to about 450 nm to harden the adhesiveand adhere the dental composite to the oral surface; wherein neither thefirst photoinitiator nor the second photoinitiator absorbs radiationabove about 520 nm.

In yet another embodiment, a process for forming a dental materialadhered to an oral surface includes: applying a hardenable dentaladhesive to an oral surface, wherein the hardenable dental adhesiveincludes a phosphine oxide that absorbs radiation within a range ofabout 380 nm to about 450 nm; applying a hardenable dental composite tothe hardenable dental adhesive on the oral surface, wherein thehardenable dental composite includes a diketone that absorbs radiationwithin a range of about 450 nm to about 520 nm; irradiating thehardenable dental composite with radiation within a range of about 450nm to about 520 nm to selectively harden the dental composite; andsubsequently irradiating the hardenable dental adhesive with radiationwithin a range of about 380 nm to about 450 nm to adhere the dentalcomposite to the oral surface; wherein neither the first photoinitiatornor the second photoinitiator absorbs radiation above about 520 nm.

Each of the above embodiments includes at least two compositions, eachof which includes at least one photoinitiator. Other embodiments inwhich only one or no photoinitiators are used are also included withinthe scope of the present invention.

In one such embodiment, the present invention provides a process forforming a dental material adhered to a surface that includes: applying afirst hardenable dental composition to the surface; applying a secondhardenable dental composition to the first hardenable dental compositionon the surface; and hardening the first and second hardenable dentalcompositions to adhere the second composition to the surface, whereinthe second hardenable composition is substantially completely hardenedprior to complete hardening of the first hardenable composition; whereinat least one of the first or second hardenable compositions ischemically hardenable.

In another embodiment, the present invention provides a process forforming a dental material adhered to an oral surface that includes:applying a hardenable dental adhesive to the oral surface; applying ahardenable dental composite to the hardenable dental adhesive on theoral surface; and hardening the hardenable dental adhesive andhardenable dental composite to adhere the composite to the surface,wherein the hardenable dental composite is substantially completelyhardened prior to complete hardening of the hardenable dental adhesive;wherein at least one of the hardenable adhesive or hardenable compositeis chemically hardenable.

The present invention also provides devises that can be used to hardendental compositions, such as those of the present invention. In oneembodiment, there is provided a dental composition hardening light thatincludes: a housing; a first light source located within the housing,the first light source emitting light in a first wavelength range; asecond light source located within the housing, the second light sourceemitting light in a second wavelength range; and a controller operablyconnected to the first light source and the second light source, thecontroller controlling emission of light from the first light source andthe second light source. Processes of hardening dental compositionsusing such lights are also encompassed by the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of one illustrative device according to thepresent invention.

FIG. 2 is a block diagram of components in one illustrative hardeningdevice according to the present invention.

FIG. 3 is a block diagram of components of another illustrativehardening device according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention provides processes for forming dental materialsadhered to a surface. The surface is typically an oral surface such asthe surface of a tooth or a bone, although other surfaces areencompassed, such as the surface of a fixture used to prepare aprosthetic device, for example.

The dental materials can be used for example, as dental adhesives,dental composites, artificial crowns, anterior or posterior fillings,casting materials, cavity liners, cements, coating compositions, millblanks, restoratives, prostheses, and sealants. In a preferred aspect,the dental material is a dental restorative. The restoratives of theinvention can be placed directly in the mouth and cured (hardened) insitu.

The processes involve applying a first hardenable dental composition(e.g., a dental adhesive) to the surface followed by applying a secondhardenable dental composition (e.g., a dental composite) to the firsthardenable dental composition on the surface. The first and secondhardenable dental compositions are hardened such that the secondhardenable composition is substantially completely hardened prior tocomplete hardening of the first hardenable composition. A “substantiallycompletely hardened” composition is one that is sufficiently hard tosupport a load that would typically be applied in a dental environment.

In certain embodiments, both the first and second hardenablecompositions include photopolymerizable materials. In other embodiments,at least one of the first or second hardenable compositions ischemically hardenable. In still other embodiments, both the first andsecond hardenable compositions are chemically hardenable. It is alsoenvisioned that photopolymerizable materials and chemically hardenablematerials can be combined in one composition if desired.

In the embodiments in which both the first and second hardenablecompositions include photopolymerizable materials, the first hardenablecomposition includes a first photoinitiator that absorbs radiationwithin a range of about 380 nm to about 520 nm (alternatively, about 380nm to about 450 nm) and the second hardenable composition includes asecond photoinitiator that absorbs radiation within a range of about 380nm to about 520 nm (alternatively, about 450 nm to about 520 nm). Inthese embodiments, neither the first photoinitiator nor the secondphotoinitiator absorbs radiation above about 520 nm.

If photoinitiators are used that absorb significant radiation aboveabout 520 nm (e.g., ethyl eosin, erythrosine, and methylene blue),significant coloring can result and would be generally unacceptable incertain practical applications, e.g., as dental fillings andrestorations. The photoinitiators of this invention preferably absorblight of about 380 nm to about 520 nm and are either nearly colorless,pale yellow, or yellow in coloration prior to and after irradiation withlight of about 380 nm to about 520 nm.

The hardenable compositions of the present invention include compoundsthat are monomers, oligomers, polymers, or combinations thereof. Suchmaterials are well known for both photopolymerizable dental compositionsas well as chemically hardenable dental compositions. Typicalpolymerizable composition may also contain suitable additives such asfluoride sources, anti-microbial agents, accelerators, stabilizers,absorbers, pigments, dyes, viscosity modifiers, surface tensiondepressants and wetting aids, antioxidants, fillers, and otheringredients well known to those skilled in the art. The amounts andtypes of each ingredient should be adjusted to provide the desiredphysical and handling properties before and after polymerization.

Generally, dental compositions include fillers of the types describedherein below. Depending on the type of resin system in the composition,e.g., cationically curable resins, different types of fillers are used.Depending on the type of composition, e.g., adhesive, different amountsof fillers are used. Such information is generally known to one of skillin the art. For example, adhesives and sealants are generally lightlyfilled (e.g., up to about 25 wt-% filler, based on the total weight ofthe composition) or unfilled. Cements often contain higher amounts offiller (e.g., about 25 wt-% to about 60 wt-% filler, based on the totalweight of filler), and filling materials can contain even higher amountsof filler (e.g., about 50 wt-% to about 90 wt-% filler, based on thetotal weight of the composition).

Photopolymerizable Compositions

The hardenable compositions used in the methods of the present inventionare in certain embodiments photopolymerizable, i.e., the compositionscontain a photoinitiator (i.e., a photoinitiator system) that uponirradiation with actinic radiation initiates the polymerization (orhardening) of the composition. Such photopolymerizable compositions canbe free radically polymerizable or cationically polymerizable.Preferably, the irradiation has a functional wavelength range from about380 nm to about 520 nm.

Suitable photopolymerizable compositions may include epoxy resins (whichcontain cationically active epoxy groups), vinyl ether resins (whichcontain cationically active vinyl ether groups), and ethylenicallyunsaturated compounds (which contain free radically active unsaturatedgroups). Examples of useful ethylenically unsaturated compounds includeacrylic acid esters, methacrylic acid esters, hydroxy-functional acrylicacid esters, hydroxy-functional methacrylic acid esters, andcombinations thereof. Also suitable are polymerizable materials thatcontain both a cationically active functional group and a free radicallyactive functional group in a single compound. Examples includeepoxy-functional acrylates, epoxy-functional methacrylates, andcombinations thereof.

Free Radically Photopolymerizable Compositions

Photopolymerizable compositions may include compounds having freeradically active functional groups that may include monomers, oligomers,and polymers having one or more ethylenically unsaturated group.Suitable compounds contain at least one ethylenically unsaturated bondand are capable of undergoing addition polymerization. Such freeradically polymerizable compounds include mono-, di- or poly-acrylatesand methacrylates such as methyl acrylate, methyl methacrylate, ethylacrylate, isopropyl methacrylate, n-hexyl acrylate, stearyl acrylate,allyl acrylate, glycerol diacrylate, glycerol triacrylate,ethyleneglycol diacrylate, diethyleneglycol diacrylate,triethyleneglycol dimethacrylate, 1,3-propanediol diacrylate,1,3-propanediol dimethacrylate, trimethylolpropane triacrylate,1,2,4-butanetriol trimethacrylate, 1,4-cyclohexanediol diacrylate,pentaerythritol triacrylate, pentaerythritol tetraacrylate,pentaerythritol tetramethacrylate, sorbitol hexacrylate,bis[1-(2acryloxy)]-p-ethoxyphenyldimethylmethane,bis[1-(3-acryloxy-2-hydroxy)]-p-propoxyphenyldimethylmethane, andtrishydroxyethyl-isocyanurate trimethacrylate; the bisacrylates andbis-methacrylates of polyethylene glycols of molecular weight 200-500,copolymerizable mixtures of acrylated monomers such as those in U.S.Pat. No. 4,652,274 (Boettcher et al.), and acrylated oligomers such asthose of U.S. Pat. No. 4,642,126 (Zador et al.); and vinyl compoundssuch as styrene, diallyl phthalate, divinyl succinate, divinyl adipateand divinyl phthalate. Other suitable free radically polymerizablecompounds include siloxane-functional (meth)acrylates as disclosed, forexample, in WO-00/38619 (Guggenberger et al.), WO-01/92271 (Weinmann etal.), WO-01/07444 (Guggenberger et al.), WO-00/42092 (Guggenberger etal.) and fluoropolymer-functional (meth)acrylates as disclosed, forexample, in U.S. Pat. No. 5,076,844 (Fock et al.), U.S. Pat. No.4,356,296 (Griffith et al.), EP-0373 384 (Wagenknecht et al.), EP-0201031 (Reiners et al.), and EP-0201 778 (Reiners et al.). Mixtures of twoor more free radically polymerizable compounds can be used if desired.

Cationically Photopolymerizable Compositions

Photopolymerizable compositions may include compounds havingcationically active functional groups such as cationically polymerizableepoxy resins. Such materials include organic compounds having an oxiranering that is polymerizable by ring opening. These materials includemonomeric epoxy compounds and epoxides of the polymeric type and can bealiphatic, cycloaliphatic, aromatic or heterocyclic. These compoundsgenerally have, on the average, at least 1 polymerizable epoxy group permolecule, preferably at least about 1.5 and more preferably at leastabout 2 polymerizable epoxy groups per molecule. The polymeric epoxidesinclude linear polymers having terminal epoxy groups (e.g., a diglycidylether of a polyoxyalkylene glycol), polymers having skeletal oxiraneunits (e.g., polybutadiene polyepoxide), and polymers having pendentepoxy groups (e.g., a glycidyl methacrylate polymer or copolymer). Theepoxides may be pure compounds or may be mixtures of compoundscontaining one, two, or more epoxy groups per molecule. The “average”number of epoxy groups per molecule is determined by dividing the totalnumber of epoxy groups in the epoxy-containing material by the totalnumber of epoxy-containing molecules present.

These epoxy-containing materials may vary from low molecular weightmonomeric materials to high molecular weight polymers and may varygreatly in the nature of their backbone and substituent groups.Illustrative of permissible substituent groups include halogens, estergroups, ethers, sulfonate groups, siloxane groups, nitro groups,phosphate groups, and the like. The molecular weight of theepoxy-containing materials may vary from about 58 to about 100,000 ormore.

Suitable epoxy-containing materials useful in the present invention arelisted in U.S. Pat. No. 6,187,836 (Oxman et al.) and U.S. Pat. No.6,084,004 (Weinmann et al.).

Blends of various epoxy-containing materials are also contemplated.Examples of such blends include two or more weight average molecularweight distributions of epoxy-containing compounds, such as lowmolecular weight (below 200), intermediate molecular weight (about 200to 10,000) and higher molecular weight (above about 10,000).Alternatively or additionally, the epoxy resin may contain a blend ofepoxy-containing materials having different chemical natures, such asaliphatic and aromatic, or functionalities, such as polar and non-polar.

Other types of useful materials having cationically active functionalgroups include vinyl ethers, oxetanes, spiro-orthocarbonates,spiro-orthoesters, and the like.

If desired, both cationically active and free radically activefunctional groups may be contained in a single molecule. Such moleculesmay be obtained, for example, by reacting a di- or poly-epoxide with oneor more equivalents of an ethylenically unsaturated carboxylic acid. Anexample of such a material is the reaction product of UVR-6105(available from Union Carbide) with one equivalent of methacrylic acid.Commercially available materials having epoxy and free-radically activefunctionalities include the CYCLOMER series, such as CYCLOMER M-100,M-101, or A-200 available from Daicel Chemical, Japan, and EBECRYL-3605available from Radcure Specialties, UCB Chemicals, Atlanta, Ga.

The cationically curable compositions may further include ahydroxyl-containing organic material. Suitable hydroxyl-containingmaterials may be any organic material having hydroxyl functionality ofat least 1, and preferably at least 2. Preferably, thehydroxyl-containing material contains two or more primary or secondaryaliphatic hydroxyl groups (i.e., the hydroxyl group is bonded directlyto a non-aromatic carbon atom). The hydroxyl groups can be terminallysituated, or they can be pendent from a polymer or copolymer. Themolecular weight of the hydroxyl-containing organic material can varyfrom very low (e.g., 32) to very high (e.g., one million or more).Suitable hydroxyl-containing materials can have low molecular weights,i.e. from about 32 to about 200, intermediate molecular weights, i.e.from about 200 to about 10,000, or high molecular weights, i.e. aboveabout 10,000. As used herein, all molecular weights are weight averagemolecular weights.

The hydroxyl-containing materials may be non-aromatic in nature or maycontain aromatic functionality. The hydroxyl-containing material mayoptionally contain heteroatoms in the backbone of the molecule, such asnitrogen, oxygen, sulfur, and the like. The hydroxyl-containing materialmay, for example, be selected from naturally occurring or syntheticallyprepared cellulosic materials. The hydroxyl-containing material shouldbe substantially free of groups which may be thermally or photolyticallyunstable; that is, the material should not decompose or liberatevolatile components at temperatures below about 100° C. or in thepresence of actinic light which may be encountered during the desiredphotopolymerization conditions for the polymerizable compositions.

Suitable hydroxyl-containing materials useful in the present inventionare listed in U.S. Pat. No. 6,187,836 (Oxman et al.).

The amount of hydroxyl-containing organic material used in thepolymerizable compositions may vary over broad ranges, depending uponfactors such as the compatibility of the hydroxyl-containing materialwith the cationically and/or free radically polymerizable component, theequivalent weight and functionality of the hydroxyl-containing material,the physical properties desired in the final composition, the desiredspeed of polymerization, and the like.

Blends of various hydroxyl-containing materials may also be used.Examples of such blends include two or more molecular weightdistributions of hydroxyl-containing compounds, such as low molecularweight (below about 200), intermediate molecular weight (about 200 toabout 10,000) and higher molecular weight (above about 10,000).Alternatively, or additionally, the hydroxyl-containing material maycontain a blend of hydroxyl-containing materials having differentchemical natures, such as aliphatic and aromatic, or functionalities,such as polar and non-polar. As an additional example, one may usemixtures of two or more poly-functional hydroxy materials or one or moremono-functional hydroxy materials with poly-functional hydroxymaterials.

The polymerizable material(s) may also contain hydroxyl groups and freeradically active functional groups in a single molecule. Examples ofsuch materials include hydroxyalkylacrylates andhydroxyalkylmethacrylates such as hydroxyethylacrylate,hydroxyethylmethacrylate; glycerol mono- or di-(meth)acrylate;trimethylolpropane mono- or di-(meth)acrylate, pentaerythritol mono-,di-, and tri-(meth)acrylate, sorbitol mono-, di-, tri-, tetra-, orpenta-(meth)acrylate; and2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy)phenyl]propane.

The polymerizable material(s) may also contain hydroxyl groups andcationically active functional groups in a single molecule. An exampleis a single molecule that includes both hydroxyl groups and epoxygroups.

Photoinitiators

Suitable photoinitiators (i.e., photoinitiator systems that include oneor more compounds) for polymerizing free radically photopolymerizablecompositions include binary and tertiary systems. Typical tertiaryphotoinitiators include an iodonium salt, a photosensitizer, and anelectron donor compound as described in U.S. Pat. No. 5,545,676(Palazzotto et al.). Preferred iodonium salts are the diaryl iodoniumsalts, e.g., diphenyliodonium chloride, diphenyliodoniumhexafluorophosphate, and diphenyliodonium tetrafluoroboarate. Preferredphotosensitizers are monoketones and diketones that absorb some lightwithin a range of about 450 nm to about 520 nm (preferably, about 450 nmto about 500 nm). More preferred compounds are alpha diketones that havesome light absorption within a range of about 450 nm to about 520 nm(even more preferably, about 450 to about 500 nm). Preferred compoundsare camphorquinone, benzil, furil, 3,3,6,6-tetramethylcyclohexanedione,phenanthraquinone and other cyclic alpha diketones. Most preferred iscamphorquinone. Preferred electron donor compounds include substitutedamines, e.g., ethyl dimethylaminobenzoate.

Suitable photoinitiators for polymerizing cationicallyphotopolymerizable compositions include binary and tertiary systems.Typical tertiary photoinitiators include an iodonium salt, aphotosensitizer, and an electron donor compound as described in U.S.Pat. No. 5,856,373 (Kaisaki et al.), U.S. Pat. No. 6,084,004 (Weinmannet al.), U.S. Pat. No. 6,187,833 (Oxman et al.), U.S. Pat. No. 6,187,836(Oxman et al.); and U.S. Pat. No. 6,765,036 (Dede et al.). Preferrediodonium salts, photosensitizers, and electron donor compounds are aslisted herein for photoinitiator systems for polymerizing free radicallyphotopolymerizable compositions.

Other suitable photoinitiators for polymerizing free radicallyphotopolymerizable compositions include the class of phosphine oxidesthat typically have a functional wavelength range of about 380 nm toabout 1200 nm. Preferred phosphine oxide free radical initiators with afunctional wavelength range of about 380 nm to about 450 nm are acyl andbisacyl phosphine oxides such as those described in U.S. Pat. No.4,298,738 (Lechtken et al.), U.S. Pat. No. 4,324,744 (Lechtken et al.),U.S. Pat. No. 4,385,109 (Lechtken et al.), U.S. Pat. No. 4,710,523(Lechtken et al.), and U.S. Pat. No. 4,737,593 (Ellrich et al.), U.S.Pat. No. 6,251,963 (Köhler et al.); and EP Application No. 0 173 567 A2(Ying).

Suitable acyl phosphine oxides have the general formula:(R¹)₂P(═O)C(═O)R²wherein: each R¹ is individually is a hydrocarbyl group (e.g., alkyl,cycloalkyl, aryl, and aralkyl, any of which can be substituted with ahalo, alkyl, or alkoxy group), wherein optionally two R¹ groups can bejoined to form a ring along with the phosphorous atom; and each R² isindependently a hydrocarbyl group, an S—, O—, or N-containing five- orsix-membered heterocyclic group (aromatic or alicyclic), or a-Z-C(═O)P(═O)(R¹)₂ group, wherein Z represents a divalent hydrocarbylgroup such as alkylene or phenylene having from 2 to 6 carbon atoms.

Suitable bisacyl phosphine oxides have the general formula:R¹P(═O)(C(═O)R²)₂wherein: R¹ is a hydrocarbyl group; and each R² is independently ahydrocarbyl group (e.g., alkyl, cycloalkyl, aryl, and aralkyl, any ofwhich can be substituted with a halo, alkyl, or alkoxy group), an S—,O—, or N-containing five- or six-membered heterocyclic group (aromaticor alicyclic).

Commercially available phosphine oxide photoinitiators capable offree-radical initiation when irradiated at wavelength ranges of greaterthan about 380 nm to about 450 nm includebis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide (IRGACURE 819, CibaSpecialty Chemicals, Tarrytown, N.Y.),bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphine oxide (CGI403, Ciba Specialty Chemicals), a 25:75 mixture, by weight, ofbis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentyl phosphine oxide and2-hydroxy-2-methyl-1-phenylpropan-1-one (IRGACURE 1700, Ciba SpecialtyChemicals), a 1:1 mixture, by weight, ofbis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide and2-hydroxy-2-methyl-1-phenylpropane-1-one (DAROCUR 4265, Ciba SpecialtyChemicals), and ethyl 2,4,6-trimethylbenzylphenyl phosphinate (LUCIRINLR8893X, BASF Corp., Charlotte, N.C.).

Preferred acyl phosphine oxides useful in the present invention arethose in which the R¹ and R² groups are phenyl, C1-C4 alkyl, or C1-C4alkoxy-substituted phenyl. Most preferably, the acyl phosphine oxide isbis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide (IRGACURE 819, CibaSpecialty Chemicals) orbis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) phosphine oxide (CGI403, Ciba Specialty Chemicals)

Typically, the phosphine oxide initiator is present in thephotopolymerizable composition in catalytically effective amounts, suchas from about 0.1 weight percent to about 5.0 weight percent, based onthe total weight of the composition.

Tertiary amine reducing agents may be used in combination with anacylphosphine oxide. Illustrative tertiary amines useful in theinvention include ethyl 4-(N,N-dimethylamino)benzoate andN,N-dimethylaminoethyl methacrylate. When present, the amine reducingagent is present in the photopolymerizable composition in an amount fromabout 0.1 weight percent to about 5.0 weight percent, based on the totalweight of the composition.

Photopolymerization Procedure and Device

The photopolymerizable compositions are typically prepared by admixing,under “safe light” conditions (i.e., conditions that do not causepremature hardening of the composition), the various components of thecompositions. Suitable inert solvents may be employed if desired whenpreparing the mixture. Examples of suitable solvents include acetone anddichloromethane.

Hardening is affected by exposing the composition to a radiation source,preferably a visible light source. It may be convenient to employ lightsources that emit visible light between about 380 nm and about 800 nm.In some instances, it may be possible to use light sources that emitlight in a more restricted spectrum, e.g., blue light with wavelengthsof about 380 nm to about 520 nm). Examples of some suitable lightsources include, but are not limited to, quartz halogen lamps,tungsten-halogen lamps, mercury arcs, carbon arcs, low-, medium-, andhigh-pressure mercury lamps, plasma arcs, light-emitting diodes, andlasers.

In general, useful light sources may have intensities in the range ofabout 200 to about 1200 mW/cm². One example, which may be useful fordental applications, is a XL-3000 dental curing light commerciallyavailable from 3M Company of St. Paul, Minn. Such lights may, e.g., havean intensity of about 400 to about 800 mW/cm² at wavelengths of about400 nm to about 500 nm.

The exposure may be affected in several ways. For example, thepolymerizable composition may be continuously exposed to radiationthroughout the entire hardening process (e.g., about 2 seconds to about60 seconds). It is also possible to expose the composition to a singledose of radiation, and then remove the radiation source, therebyallowing polymerization to occur. In some cases materials can besubjected to light sources that ramp from low intensity to highintensity.

Where multiple exposures are employed, the intensity of each dosage maybe the same or different. Similarly, the total energy of each exposuremay be the same or different.

Because hardening of the hardenable compositions may be affected byexposure to light of different wavelengths, different devices, eachproviding light in the different wavelength ranges, could be used toeffect selective hardening of the compositions. It may, however, bedesirable to supply one device capable of selectively providing light inthe different wavelength ranges such that a user need handle only onedevice during hardening. In other alternatives, that single device maybe designed to automatically supply the different wavelengths forselected time intervals and at selected intensities.

FIG. 1 depicts one illustrative embodiment of a hardening device 10 thatmay be used in connection with the present invention. The device 10 maybe provided with a base 12 that can hold the device 10 in a convenientorientation and that may also serve as a charging stand if the device 10is powered by batteries. The device 10 may include a housing 14 that mayhave a generally cylindrical shape as seen in FIG. 1. In the depictedembodiment, the device includes a switch 16 to activate one or morelight sources such that light is delivered through the tip 18 of thedevice 10.

The depicted device 10 is to be considered exemplary in nature only.Other light sources that may be used in connection with hardenabledental compositions are described in, e.g., U.S. Pat. No. 4,516,195(Gonser); U.S. Pat. No. 4,888,489 (Bryan); and U.S. Pat. No. 5,147,204(Patten et al.); as well as in International Publication Nos. WO99/22667 (Broyles et al.) and WO 01/64129 (Adam et al.).

Because the different hardenable compositions of the present inventionharden in response to light of different wavelengths, it may bepreferred that the device 10 be capable of selectively providing lightin the different wavelengths needed to cure the different hardenablecompositions. Turning to FIG. 2, a block diagram of the some of thecomponents that may be contained within the device 10 are depicted. Thedevice 10 preferably includes a switch 16 that can be used to activatethe light source. The switch 16 is operatively connected to a controller20 that is, in turn operatively connected to a pair of light sources 24and 26. The controller 20 is also preferably connected to a power source22 (e.g., battery, fuel cell, etc.) that preferably provides power tocontroller 20 and the light sources 24 and 26.

The light sources 24 and 26 may be limited to emitting light in selectedwavelength ranges, and those ranges may or may not overlap. For example,the first light source 24 may emit light only within a first wavelengthrange (e.g., about 380 nm to about 450 nm), while the second lightsource may emit light only within the second wavelength range (e.g.,about 450 nm to about 520 nm). Alternatively, one of the light sourcesmay emit light in both the first and second wavelength ranges (or evenbroader, e.g., one of the light sources may emit broadband white light).In another alternative, the light sources may include filters to limitthe wavelengths of light emitted. In still another variation, it may bepossible to use a device including one light source emitting light overall desired wavelength ranges and one or more filters to selectivelydeliver light in selected wavelength ranges. One example of such adevice may be described in, e.g., U.S. Pat. No. 4,516,195 (Gonser).

Although one system for providing light of different wavelengths isdepicted in FIG. 2, it should be understood that many variations in theactual construction of a hardening device useful in connection with thepresent invention may be possible. For example, the switch 16 may beoptional if activation of the device can be accomplished by othertechniques (e.g., simply removing the device 10 from the stand 12 maytrigger an internal switch to activate the device in some embodiments).In another alternative, the controller 20 may be integrated into thelight sources 24 and 26. In still another potential variation, eachlight source 24 and 26 may be attached directly to the power source 22or to their own individual power sources. Further, the controller 20 maybe provided as, e.g., a digital microprocessor, analog circuit, orcombination of digital and analog controls. Other variations in theparticular arrangement and selection of components will be known tothose skilled in the art.

Further, although the light sources 24 and 26 are depicted in FIG. 2 asseparate and distinct components, it should be understood that theycould be supplied together as an integrated component. One example of anintegrated LED light source capable of providing light in differentwavelengths is described in U.S. Patent Application Publication No. US2001/0032985 A1 (Bhat et al.). Others will be known to those skilled inthe art.

FIG. 3 depicts a block diagram of one alternative hardening device 110that may be used in connection with the present invention. In the device110, two separate light sources 124 and 126 are each controlled by theirown controllers 120 a and 120 b, respectively. Each of the controllers120 a and 120 b is activated by a separate optional switch 116 a and 116b, respectively. Such a system may be amenable to use in a manual lightdelivery protocol as discussed below.

In any hardening device used in connection with the present invention, avariety of different light delivery protocols may be used to deliverlight of the selected wavelength ranges such that selective hardening ofthe hardenable compositions is achieved. In one example, the hardenablecompositions may include a first hardenable composition with a firstphotoinitiator that absorbs radiation within a range of about 380 nm toabout 450 nm and a second hardenable composition with a secondphotoinitiator that absorbs radiation within a range of about 450 nm toabout 520 nm. In other words, a first hardenable composition hardens inresponse to light within a first wavelength range and a secondhardenable composition hardens in response to light within a secondwavelength range. In one light delivery protocol, the delivery of lightto harden these hardenable compositions may involve initially providinglight with a wavelength of about 450 nm or more to selectively hardenthe second hardenable composition. It may, in some instances, be desiredto limit the upper end of the wavelength range to about 520 nm or less.With the second hardenable composition at least partially or fullyhardened, light with a wavelength of about 450 nm or less may beprovided to harden the first hardenable composition. It may, in someinstances, be desired to limit the lower end of the wavelength range toabout 380 nm or more. This light delivery protocol may be described assequential, i.e., light within a second wavelength range is deliveredfor an initial interval and stopped, followed by delivery of lightwithin a first wavelength range after termination of the initialinterval.

In another light delivery protocol, the delivery of light to hardenthese hardenable compositions may involve initially providing light witha second wavelength range of about 450 nm or more such that the secondhardenable composition can be selectively hardened (with the option oflimiting the upper end of the second wavelength range to about 520 nm orless). With the second hardenable composition at least partially orfully hardened, light within a first wavelength range of about 450 nm orless may be provided to harden the first hardenable composition (withthe option of limiting the lower end of the wavelength range to about380 nm or more). The difference in this alternative is that delivery oflight within the second wavelength range is not terminated during thedelivery of light within the first wavelength range. As a result, thesubsequent phase of light delivery includes light both above and below450 nm (with optional lower and upper limits of about 380 nm and about520 nm). This protocol for light delivery may be described ascumulative, i.e., light within a second wavelength range is deliveredfor an initial interval, followed by delivery of light within both thefirst and a second wavelength ranges after termination of the initialinterval. In such a cumulative light delivery protocol, the secondhardenable composition may be only partially hardened when only light inthe second wavelength range is delivered, with complete hardening of thesecond hardenable composition occurring during delivery of light in boththe first and second wavelength ranges.

These and other different light delivery protocols may preferably beautomatically implemented by, e.g., a controller or controllers within ahardening device of the present invention. Alternatively, the differentprotocols may be manually implemented by a user activating lightdelivery in the different wavelengths during the hardening process.

Chemically Polymerizable Compositions

The hardenable compositions of the present invention are in certainembodiments, e.g., dental adhesive compositions, chemically hardenable,i.e., the compositions contain a chemical initiator (i.e., initiatorsystem) that can polymerize, cure, or otherwise harden the compositionwithout dependence on irradiation with actinic radiation. Suchchemically hardenable (e.g., polymerizable or curable) composition aresometimes referred to as “self-cure” compositions and may include glassionomer cements, resin-modified glass ionomer cements, redox curesystems, and combinations thereof.

Glass Ionomer Cements

The chemically hardenable compositions may include conventional glassionomers that typically employ as their main ingredients a homopolymeror copolymer of an ethylenically unsaturated carboxylic acid (e.g., polyacrylic acid, copoly (acrylic, itaconic acid), and the like), afluoroaluminosilicate (“FAS”) glass, water, and a chelating agent suchas tartaric acid. Conventional glass ionomers typically are supplied inpowder/liquid formulations that are mixed just before use. The mixturewill undergo self-hardening in the dark due to an ionic reaction betweenthe acidic repeating units of the polycarboxylic acid and cationsleached from the glass.

Resin-Modified Glass Ionomer Cements

The chemically hardenable compositions may include resin-modified glassionomer (“RMGI”) cements. Like a conventional glass ionomer, an RMGIcement employs an FAS glass. However, the organic portion of an RMGI isdifferent. In one type of RMGI, the polycarboxylic acid is modified toreplace or end-cap some of the acidic repeating units with pendentcurable groups and a photoinitiator is added to provide a second curemechanism, e.g., as described in U.S. Pat. No. 5,130,347 (Mitra).Acrylate or methacrylate groups are usually employed as the pendantcurable group. In another type of RMGI, the cement includes apolycarboxylic acid, an acrylate or methacrylate-functional monomer anda photoinitiator, e.g., as in Mathis et al., “Properties of a New GlassIonomer/Composite Resin Hybrid Restorative”, Abstract No. 51, J. DentRes., 66:113 (1987) and as in U.S. Pat. No. 5,063,257 (Akahane et al.),U.S. Pat. No. 5,520,725 (Kato et al.), U.S. Pat. No. 5,859,089 (Qian),U.S. Pat. No. 5,925,715 (Mitra) and U.S. Pat. No. 5,962,550 (Akahane etal.). In another type of RMGI, the cement may include a polycarboxylicacid, an acrylate or methacrylate-functional monomer, and a redox orother chemical cure system, e.g. as described in U.S. Pat. No. 5,154,762(Mitra et al.), U.S. Pat. No. 5,520,725 (Kato et al.), and U.S. Pat. No.5,871,360 (Kato). In another type of RMGI, the cement may includevarious monomer-containing or resin-containing components as describedin U.S. Pat. No. 4,872,936 (Engelbrecht), U.S. Pat. No. 5,227,413(Mitra), U.S. Pat. No. 5,367,002 (Huang et al.), and U.S. Pat. No.5,965,632 (Orlowski et al.). RMGI cements are preferably formulated aspowder/liquid or paste/paste systems, and contain water as mixed andapplied. The compositions are able to harden in the dark due to theionic reaction between the acidic repeating units of the polycarboxylicacid and cations leached from the glass, and commercial RMGI productstypically also cure on exposure of the cement to light from a dentalcuring lamp. RMGI cements that contain a redox cure system and that canbe cured in the dark without the use of actinic radiation are describedin U.S. Pat. No. 6,765,038 (Mitra).

Redox Cure Systems

The chemically hardenable compositions may include redox cure systemsthat include a polymerizable component (e.g., an ethylenicallyunsaturated polymerizable component) and redox agents that include anoxidizing agent and a reducing agent. Suitable polymerizable components,redox agents, optional acid-functional components, and optional fillersthat are useful in the present invention are described in U.S. PatentApplication Publication No. 2003-0166740-A1 (Mitra et al.) and U.S. Pat.No. 6,982,288 (Mitra et al.).

The reducing and oxidizing agents should react with or otherwisecooperate with one another to produce free-radicals capable ofinitiating polymerization of the resin system (e.g., the ethylenicallyunsaturated component). This type of cure is a dark reaction, that is,it is not dependent on the presence of light and can proceed in theabsence of light. The reducing and oxidizing agents are preferablysufficiently shelf-stable and free of undesirable colorization to permittheir storage and use under typical dental conditions. They should besufficiently miscible with the resin system (and preferablywater-soluble) to permit ready dissolution in (and discourage separationfrom) the other components of the polymerizable composition.

Useful reducing agents include ascorbic acid, ascorbic acid derivatives,and metal complexed ascorbic acid compounds as described in U.S. Pat.No. 5,501,727 (Wang et al.); amines, especially tertiary amines, such as4-tert-butyl dimethylaniline; aromatic sulfinic salts, such asp-toluenesulfinic salts and benzenesulfinic salts; thioureas, such as1-ethyl-2-thiourea, tetraethyl thiourea, tetramethyl thiourea,1,1-dibutyl thiourea, and 1,3-dibutyl thiourea; and mixtures thereof.Other secondary reducing agents may include cobalt (II) chloride,ferrous chloride, ferrous sulfate, hydrazine, hydroxylamine (dependingon the choice of oxidizing agent), salts of a dithionite or sulfiteanion, and mixtures thereof. Preferably, the reducing agent is an amine.

Suitable oxidizing agents will also be familiar to those skilled in theart, and include but are not limited to persulfuric acid and saltsthereof, such as sodium, potassium, ammonium, cesium, and alkyl ammoniumsalts. Additional oxidizing agents include peroxides such as benzoylperoxides, hydroperoxides such as cumyl hydroperoxide, t-butylhydroperoxide, and amyl hydroperoxide, as well as salts of transitionmetals such as cobalt (III) chloride and ferric chloride, cerium (IV)sulfate, perboric acid and salts thereof, permanganic acid and saltsthereof, perphosphoric acid and salts thereof, and mixtures thereof.

It may be desirable to use more than one oxidizing agent or more thanone reducing agent. Small quantities of transition metal compounds mayalso be added to accelerate the rate of redox cure. In some embodimentsit may be preferred to include a secondary ionic salt to enhance thestability of the polymerizable composition as described in U.S. Pat. No.6,982,288 (Mitra et al.).

The reducing and oxidizing agents are present in an amount sufficient topermit an adequate free-radical reaction rate. This can be evaluated bycombining all of the ingredients of the polymerizable composition exceptfor the optional filler, and observing whether or not a hardened mass isobtained.

Preferably, the reducing agent is present in an amount of at least about0.01 wt-%, and more preferably at least about 0.1 wt-%, based on thetotal weight (including water) of the components of the polymerizablecomposition. Preferably, the reducing agent is present in an amount ofno greater than about 10 wt-%, and more preferably no greater than about5 wt-%, based on the total weight (including water) of the components ofthe polymerizable composition.

Preferably, the oxidizing agent is present in an amount of at leastabout 0.01 wt-%, and more preferably at least about 0.10 wt-%, based onthe total weight (including water) of the components of thepolymerizable composition. Preferably, the oxidizing agent is present inan amount of no greater than about 10 wt-%, and more preferably nogreater than about 5 wt-%, based on the total weight (including water)of the components of the polymerizable composition.

The reducing or oxidizing agents can be microencapsulated as describedin U.S. Pat. No. 5,154,762 (Mitra et al.). This will generally enhanceshelf stability of the polymerizable composition, and if necessarypermit packaging the reducing and oxidizing agents together. Forexample, through appropriate selection of an encapsulant, the oxidizingand reducing agents can be combined with an acid-functional componentand optional filler and kept in a storage-stable state. Likewise,through appropriate selection of a water-insoluble encapsulant, thereducing and oxidizing agents can be combined with an FAS glass andwater and maintained in a storage-stable state.

A redox cure system can be combined with other cure systems, e.g., witha glass ionomer cement and with a photopolymerizable composition such asdescribed U.S. Pat. No. 5,154,762 (Mitra et al.).

The hardenable compositions that utilize a redox cure system can besupplied in a variety of forms including two-part powder/liquid,paste/liquid, and paste/paste systems. Other forms employing multi-partcombinations (i.e., combinations of two or more parts), each of which isin the form of a powder, liquid, gel, or paste are also possible. In amulti-part system, one part typically contains the reducing agent(s) andanother part typically contains the oxidizing agent(s). Therefore, ifthe reducing agent is present in one part of the system, then theoxidizing agent is typically present in another part of the system.However, the reducing agent and oxidizing agent can be combined in thesame part of the system through the use of the microencapsulationtechnique.

Fillers

The hardenable compositions of the present invention can also containfillers. Fillers may be selected from one or more of a wide variety ofmaterials suitable for incorporation in compositions used for dentalapplications, such as fillers currently used in dental restorativecompositions, and the like.

The filler is preferably finely divided. The filler can have a unimodialor polymodial (e.g., bimodal) particle size distribution. Preferably,the maximum particle size (the largest dimension of a particle,typically, the diameter) of the filler is less than about 10micrometers, and more preferably less than about 2.0 micrometers.Preferably, the average particle size of the filler is less than about3.0 micrometers, and more preferably less than about 0.6 micrometer.

The filler can be an inorganic material. It can also be a crosslinkedorganic material that is insoluble in the resin system, and isoptionally filled with inorganic filler. The filler should in any eventbe nontoxic and suitable for use in the mouth. The filler can beradiopaque or radiolucent. The filler is also substantially insoluble inwater.

Examples of suitable inorganic fillers are naturally occurring orsynthetic materials including, but not limited to: quartz; nitrides(e.g., silicon nitride); glasses derived from, for example, Ce, Sb, Sn,Ba, Zn, and Al; feldspar; borosilicate glass; kaolin; talc; titania; lowMohs hardness fillers such as those described in U.S. Pat. No. 4,695,251(Randklev); and submicron silica particles (e.g., pyrogenic silicas suchas those available under the trade designations AEROSIL, including “OX50,” “130,” “150” and “200” silicas from Degussa Corp., Akron, Ohio andCAB-O-SIL M5 silica from Cabot Corp., Tuscola, Ill.). Examples ofsuitable organic filler particles include filled or unfilled pulverizedpolycarbonates, polyepoxides, and the like.

Preferred non-acid-reactive filler particles are quartz, submicronsilica, and non-vitreous microparticles of the type described in U.S.Pat. No. 4,503,169 (Randklev). Mixtures of these non-acid-reactivefillers are also contemplated, as well as combination fillers made fromorganic and inorganic materials.

The surface of the filler particles can also be treated with a couplingagent in order to enhance the bond between the filler and the resin. Theuse of suitable coupling agents includegamma-methacryloxypropyltrimethoxysilane,gamma-mercaptopropyltriethoxysilane, gamma-aminopropyltrimethoxysilane,and the like.

The filler can also be an acid-reactive filler. An acid-reactive filleris typically used in combination with an acid-functional resincomponent, and may or may not be used in combination with a nonreactivefiller. The acid-reactive filler can, if desired, also possess theproperty of releasing fluoride. Suitable acid-reactive fillers includemetal oxides, glasses, and metal salts. Preferred metal oxides includebarium oxide, calcium oxide, magnesium oxide, and zinc oxide. Preferredglasses include borate glasses, phosphate glasses, andfluoroaluminosilicate (“FAS”) glasses. FAS glasses are particularlypreferred. The FAS glass preferably contains sufficient elutable cationsso that a hardened dental composition will form when the glass is mixedwith the components of the hardenable composition. The glass alsopreferably contains sufficient elutable fluoride ions so that thehardened composition will have cariostatic properties. The glass can bemade from a melt containing fluoride, alumina, and other glass-formingingredients using techniques familiar to those skilled in the FASglassmaking art. The FAS glass preferably is in the form of particlesthat are sufficiently finely divided so that they can conveniently bemixed with the other cement components and will perform well when theresulting mixture is used in the mouth.

Preferably, the average particle size (typically, diameter) for the FASglass is no greater than about 10 micrometers, and more preferably nogreater than about 5 micrometers as measured using, for example, asedimentation analyzer. Suitable FAS glasses will be familiar to thoseskilled in the art, and are available from a wide variety of commercialsources, and many are found in currently available glass ionomer cementssuch as those commercially available under the trade designationsVITREMER, VITREBOND, RELY X LUTING CEMENT and KETAC-FIL (3M ESPE DentalProducts, St. Paul, Minn.), FUJI II, GC FUJI LC and FUJI IX (G-C DentalIndustrial Corp., Tokyo, Japan) and CHEMFIL Superior (DentsplyInternational, York, Pa.). Mixtures of fillers can be used if desired.

The FAS glass can optionally be subjected to a surface treatment.Suitable surface treatments include, but are not limited to, acidwashing (e.g., treatment with a phosphoric acid), treatment with aphosphate, treatment with a chelating agent such as tartaric acid, andtreatment with a silane or an acidic or basic silanol solution.Desirably the pH of the treating solution or the treated glass isadjusted to neutral or near-neutral, as this can increase storagestability of the hardenable composition.

In certain compositions mixtures of acid-reactive and non-acid-reactivefillers can be used either in the same part or in different parts.

Other suitable fillers are disclosed in U.S. Pat. No. 6,387,981 (Zhanget al.) as well as International Publication Nos. WO 01/30304 (Wu etal.), WO 01/30305 (Zhang et al.), WO 01/30306 (Windisch et al.), and WO01/30307 (Zhang et al.).

U.S. Pat. No. 6,306,926 (Bretscher et al.) disclose a number ofradiopacifying fillers that can be used in both free radicallypolymerizable compositions, cationically polymerizable compositions, andhybrid compositions featuring both free radically and cationicallypolymerizable components. They are particularly advantageous for use incationically polymerizable compositions. One such filler is amelt-derived filler that includes 5-25% by weight aluminum oxide, 10-35%by weight boron oxide, 15-50% by weight lanthanum oxide, and 20-50% byweight silicon oxide. Another filler is a melt-derived filler thatincludes 10-30% by weight aluminum oxide, 10-40% by weight boron oxide,20-50% by weight silicon oxide, and 15-40% by weight tantalum oxide. Athird filler is a melt-derived filler that includes 5-30% by weightaluminum oxide, 5-40% by weight boron oxide, 0-15% by weight lanthanumoxide, 25-55% by weight silicon oxide, and 10-40% by weight zinc oxide.A fourth filler is a melt-derived filler that includes 15-30% by weightaluminum oxide, 15-30% by weight boron oxide, 20-50% by weight siliconoxide, and 15-40% by weight ytterbium oxide. A fifth filler is in theform of non vitreous microparticles prepared by a sol-gel method inwhich an aqueous or organic dispersion or sol of amorphous silicon oxideis mixed with an aqueous or organic dispersion, sol, or solution of aradiopacifying metal oxide, or precursor organic or compound. A sixthfiller is in the form of non-vitreous microparticles prepared by asol-gel method in which an aqueous or organic dispersion or sol ofamorphous silicon oxide is mixed with an aqueous or organic dispersion,sol, or solution of a radiopacifying metal oxide, or precursor organicor inorganic compound.

Dental Adhesives

Numerous examples of hard tissue adhesives have been disclosed. Forexample, U.S. Pat. No. 4,719,149 (Aasen et al.) and references thereininclude a variety of materials and methods for adheringmethacrylate-based composites to hard tissues. There are many otherpatents that describe various preferred materials and protocols forbonding to teeth, such as for example, U.S. Pat. No. 5,256,447 (Oxman etal.) and U.S. Pat. No. 5,525,648 (Aasen et al.). U.S. Pat. No. 5,980,253(Oxman et al.) describes materials and methods for bonding cationicallycurable compositions to hard tissues. Also, siloxane-functional(meth)acrylates as disclosed in WO-00/38619 (Guggenberger et al.),WO-01/92271 (Weinmann et al.), WO-01/07444 (Guggenberger et al.),WO-00/42092 (Guggenberger et al.), and fluoropolymer-functional(meth)acrylates as disclosed in U.S. Pat. No. 5,076,844 (Fock et al.),U.S. Pat. No. 4,356,296 (Griffith et al.), EP-0373 384 (Wagenknecht etal.), EP-0201 031 (Reiners et al.), EP-0201 778 (Reiners et al.) can beused as dental adhesives.

Certain embodiments of the dental adhesives include at least one freeradical inhibitor. The amount of inhibitor is sufficient to reduce theamount of cross-boundary polymerization. Examples include BHT(2,6-di-tert-butyl-4-methylphenol), MEHQ (methylethyl hydroquinone), andbisphenol-A. Typically, the inhibitor is used in an amount of about 0.05wt-% to about 1.0 wt-%, based on the weight of the resin (e.g., adhesivecomposition without filler).

Such known materials can be used in the processes of the presentinvention. Generally, these materials have been used in processes thatinitially harden the adhesive and then the composite material. That is,conventional methods utilize one or more of the following steps: surfacetreatment of the tooth (e.g., etching, priming), application of ahardenable adhesive to the tooth surface, curing of the adhesive,placement of a composite material (e.g., restorative) on the hardenedadhesive, and curing of the composite material. Such methods alsotypically utilize a blue light source emitting between approximately 380nm to 520 nm to induce hardening.

In contrast, according to the present invention the composite materialis substantially completely hardened prior to complete hardening of theadhesive. For example, in one embodiment, the hardenable adhesiveincludes a first photoinitiator that absorbs radiation within a range ofabout 380 nm to about 450 nm (e.g., a phosphine oxide), is irradiatedonly after the hardenable dental composite, which includes a secondphotoinitiator that absorbs radiation within a range of about 450 nm toabout 520 nm, is hardened. This occurs through the use of twophotoinitators that absorb radiation at different wavelengths, such thatthe hardening process can be controlled through the separate andsequential use of two different wavelengths of irradiation.

Dental Composites

The composites of the present invention are generally considered to behighly filled compositions and are typically hardened (e.g., polymerizedor cured) using either free radical and or cationic photoinitiatorsystems, e.g., the ternary photoinitiator systems described herein. Whencured the composites are effective as filling or restorative materialsto fill a hole, crack, or cavity, e.g., a cavity within a tooth.

Preferred composite materials include methacrylate and epoxycompositions as well as glass ionomers that include polyacrylic acids,water, FAS glasses, and optionally free radically polyermizable resinsand polymerization catalysts such as described in U.S. Pat. No.6,306,926 (Bretscher et al.) and U.S. Pat. No. 6,030,606 (Holmes).

Objects and advantages of this invention are further illustrated by thefollowing examples, but the particular materials and amounts thereofrecited in these examples, as well as other conditions and details,should not be construed to unduly limit this invention. Unless otherwiseindicated, all parts and percentages are on a weight basis, all water isdeionized water, and all molecular weights are weight average molecularweight.

EXAMPLES

Abbreviations, Descriptions, and Sources of Materials AbbreviationDescription Source Bis-GMA 2,2-Bis[4-(2-hydroxy-3- CAS No. 1565-94-2methacryloyloxy- propoxy)phenyl]propane EDMAB Ethyl4-dimethylaminobenzoate Sigma-Aldrich (St. Louis, MO) BHT2,6-Di-tert-butyl-4- Sigma-Aldrich methylphenol HEMA 2-Hydroxyethylmethacrylate; Sigma-Aldrich contains 150 ppm 4- methoxyphenol as aninhibitor. CPQ Camphorquinone visible light Sigma-Aldrich sensitizerOMAN 072 SbF₆ iodonium salt Gelest, Tullytown, PA IRGACURE Phosphineoxide initiator Ciba Specialty 819 Chemicals Corp., Terrytown, NY Z100Dental restorative (A3 Shade) 3M Company, St. Paul, (Contains CPQsensitizer) MN P-60 Dental restorative 3M Company (Contains CPQsensitizer) DPI HFP Diphenyliodonium Johnson Matthey,hexafluorophosphate Alpha Aesar Division, Ward Hill, NJ TEGDMATriethylene glycol Sartomer Co., West dimethacrylate Chester, PA BPOBenzoyl Peroxide Sigma-Aldrich DHEPT N,N-Bis(2-hydroxyethyl)-p-Sigma-Aldrich toluidine Tinuvin p 2-(2′-hydroxy-5′-methylphenyl)- CibaSpecialty benzotriazole; UV inhibitor Chemicals Corp. BME Benzoin methylether Ciba Specialty (2-methoxy-2- Chemicals Corp. phenylacetophenone)MDEA Methyldiethanolamine Sigma-Aldrich Eosin Y 2′,4′,5′,7′-Sigma-Aldrich Tetrabromofluorescein, disodium saltTest Methods

Shear Bond Strength: Shear bond strength was evaluated by mounting thetooth sample in a holder clamped in the jaws of an “Instron” apparatuswith the tooth surface (dentin or enamel) oriented parallel to thedirection of pull. A loop of orthodontic wire (0.44-mm diameter) wasplaced around the hardened restorative material that was bound to thetooth surface. The ends of the orthodontic wire were clamped in thepulling jaw of the Instron apparatus, thereby placing the bond in shearstress. The bond was stressed using a crosshead speed of 2 mm/min untilthe restorative material separated from the tooth surface. The force (inMPa) required to break the bond was reported as an average of 5 samples.

Tooth Strain: Strain measurements of restored teeth using strain gaugeswere conducted according to the methodology described in the followingpublications: Morin D, DeLong R, Douglas W H, Cusp reinforcement by theacid-etch technique, J Dent Res 1984, 63: 1075-1078; Morin D L, DouglasW H, Cross M, DeLong R, Biophysical stress analysis of restored teeth:experimental strain measurement, Dent Mater 1988, 4: 41-48; Lopes L M P,Leitao J G M, Douglas W H, Effect of a new resin inla/only restorativematerial on cuspal reinforcement, Quintessence Int 1991, 22: 641-645.

Briefly, strain gauges (Type CEA-06-032UW-120, Measurements Group, Inc.,Micro-Measurements Division, Raleigh, N.C.) were bonded to oppositesides of extracted human teeth (premolars) cut with amesial-occlusal-distal (MOD) setup for subsequent restoration utilizingmethods of the present invention. The bonding was achieved with M-Bond200 Adhesive Kit (Measurements Group, Inc., M-Line Accessories, Raleigh,N.C.). The strain gauges were connected to a strain conditioner(Eight-Channel 2100 System, Measurements Group, Inc., InstrumentsDivision, Raleigh, N.C.) using a quarter-bridge circuit layout (externaldummy). The strain conditioner was connected to a PC (Slimline-325(386), Northgate Computer Systems, Northgate Innovations, Inc., City ofIndustry, CA; Acquisition Software Program: Labtech Notebook (version6.2.0), Adept Scientific Inc., Bethesda, Md.) for real-time acquisitionof both strain guage channels versus time at 5 Hz for 300 seconds permeasurement. Results for various restoration procedures were reported in“microstrain” units with larger values indicative of greater toothstress and strain within the restoration.

Adhesive Compositions

Adhesive A: An adhesive composition was prepared by combining a 65/35weight-% blend of bis-GMA/HEMA with CPQ (0.5%), EDMAB (0.5%), and OMAN072 SbF₆ iodonium salt (0.5%). The composition was designated AdhesiveA.

Adhesives B-H: An adhesive composition was prepared by combining a 65/35weight-% blend of bis-GMA/HEMA with IRGACURE 819 (1.5%) and BHTinhibitor (0.5%). The composition was designated Adhesive B. AdhesivesC—H were prepared as described for Adhesive B, except with differentconcentration levels of IRGACURE 819 and BHT as shown in Table 1. TABLE1 Compositions of Adhesives B-H. Adhesive % BHT % IRGACURE 819 B 0.5 1.5C 0.2 1.5 D 0.1 0.5 E 0.1 1.5 F 0.025 0.5 G 0.0625 1.0 H 0.025 1.5Adhesive I: An adhesive composition was prepared by combining a 60/40weight-% blend of bis-GMA/HEMA with IRGACURE 819 (0.5%) and BHTinhibitor (0.1%). The composition was designated Adhesive I.

Example 1 Selective Curing of Compositions Having DifferentPhotoinitiator Systems

The objective of this example was to demonstrate that compositionshaving different photoinitiator systems could be selectively cured(i.e., polymerized to a hardened material) with applied light havingdifferent effective wavelength ranges. An additional objective was tomeasure shear bond strength of sequentially irradiated tooth samplescoated with various adhesive compositions and filled with a dentalrestorative.

Enamel and dentin tooth samples were prepared in a conventional mannerby grinding with standard 120 grit/600 grit, etching with SCOTCHBONDphosphoric acid etchant (3M Company), and priming with SCOTCHBONDmulti-purpose primer (3M Company). A thin coating of Adhesive A orAdhesive B was then applied to separately prepared tooth samples andleft uncured. A Teflon mold 2.5-mm thick and having a cylindrical 4-mmdiameter hole was placed over each adhesive-coated tooth sample andfilled with Z100 dental restorative. The adhesive-coated andrestorative-filled tooth samples were then irradiated by one of thefollowing two curing methods:

Curing Method 1. The tooth samples were irradiated by exposure at 50mw/cm² for 10 seconds to an ACCUCURE 3000 Laser (Lasermed, Salt LakeCity, Utah) having an effective wavelength range of about 460-500 nm.Radiation at this wavelength range would be expected to cure materialshaving CPQ-based photoinitiator systems that generally cure within awavelength range of about 400-500 nm, but would not be expected to curematerials having IRGACURE 819 photoinitiator systems that generally curewithin a wavelength range of about 380-450 nm.

Curing Method 2. The tooth samples were irradiated by Curing Method 1and then subsequently irradiated by exposure at 800 mw/cm² for 20seconds to a VISILUX 2500 halogen light (3M Company) having an effectivewavelength range of about 400-500 nm. Radiation at this wavelength rangewould be expected to cure materials having either CPQ-based or IRGACURE819 photoinitiator systems.

Shear Bond Strength Determinations. The irradiated tooth samples werethen evaluated for shear bond strength according to the Shear BondStrength Test Method described herein and the results are reported inTable 2. High bond strength is generally achieved when both the adhesivelayer and the restorative are in a cured (i.e., hardened) state.

In the case of tooth samples irradiated by Curing Method 1 (curing atabout 460-500 nm), high bond strength was achieved with Adhesive A(containing CPQ) and Z100 (containing CPQ) (Run 1), but not withAdhesive B (containing IRGACURE 819 and Z100 (Runs 2 and 3). It isconcluded that irradiating at 460-500 nm cured Adhesive A and Z100restorative, but did not cure Adhesive B.

In the case of tooth samples irradiated by Curing Method 2 (irradiatingat about 460-500 nm followed by irradiating at about 400-500 nm), highbond strength was achieved with both Adhesive A/Z100 and Adhesive B/Z100combinations (Runs 4-6). It is concluded that curing by this methodfirst cured Adhesive A and Z100 restorative (at 460-500 nm) and thencured Adhesive B (at 400-500 nm). TABLE 2 Shear Bond Strength ofAdhesive-Coated, Z100 Composite-Filled Tooth Samples FollowingIrradiation. Shear Photoinitiator Bond System Curing Strength RunSubstrate Adhesive In Adhesive Method MPa (SD) 1 Enamel Adhesive ACPQ-Based 1 18.9 (4.3) 2 Enamel Adhesive B IRGACURE 819 1  1.9 (1.8) 3Dentin Adhesive B IRGACURE 819 1  0.5 (0.7) 4 Enamel Adhesive ACPQ-Based 2 20.6 (3.8) 5 Enamel Adhesive B IRGACURE 819 2 16.9 (5.6) 6Dentin Adhesive B IRGACURE 819 2 12.4 (4.6)

Example 2 Selective Curing of Compositions Having DifferentPhotoinitiator Systems

A layer of Adhesive A or Adhesive B was coated on separate glass slidesfollowed by the addition of a Z100 restorative layer to each adhesivelayer. Following irradiation of the coated slides with an ACCUCURE 3000Laser as described in Example 1 (Curing Method 1), the Z100 layer couldbe moved readily on the Adhesive B-coated slide; whereas, the Z100 layerwas firmly adhered to the Adhesive A-coated slide. Subsequentirradiation with a VISILUX 2500 halogen light as described in Example 1(Curing Method 2) caused the Z100 layer to become firmly adhered to theAdhesive B-coated slide.

Example 3 Selective Curing of Compositions Having DifferentPhotoinitiator Systems

An aliquot of Adhesive A or Adhesive B was added to separate glass vialsfollowed by the addition of an aliquot of P-60 restorative to each vial.Following irradiation of the filled vials for 15 seconds with theACCUCURE 3000 Laser, the P-60 restorative cured to a solid polymer in asolidified Adhesive A; whereas in the other vial, the P-60 solid polymerwas surrounded by a still fluid Adhesive B. Subsequent irradiation witha VISILUX 2500 halogen light as described in Example 1 (Curing Method 2)would be expected to solidify Adhesive B.

It is concluded from the results of Examples 2 and 3 that irradiation ata wavelength range of 460-500 cured Adhesive A and Z100 restorative(both with CPQ-based photoinitiator systems), but not Adhesive B (withIRGACURE 819); and that subsequent irradiation at a wavelength range of400-500 cured or would cure Adhesive B.

Example 4 Effect of BHT/IRGACURE 819 Concentrations on Selective Curing

Aliquots of Adhesives B-H were separately placed on glass slides andirradiated with an ACCUCURE 3000 Laser as described in Example 1 (CuringMethod 1). The adhesive compositions did not cure to a hardened state.

Thin layers of Adhesives B-H were then coated on separate glass slidesfollowed by the addition of a Z100 restorative layer to each adhesivelayer. Following irradiation of the coated slides with an ACCUCURE 3000Laser as described in Example 1 (Curing Method 1), the cured solid Z100layers on Adhesive D-H layers were adhered to the glass slides; whereas,the cured solid Z100 layers on Adhesives B-C did not adhere to the glassslides.

The adherence of the Z100 layers with the Adhesive D-H layers may beattributed to cross-boundary cure (i.e., polymerization) initiated bythe Z100 cure and may have occurred due to insufficient BHT free radicalinhibitor in the Adhesives. In contrast, the lack of adherence of theZ100 layers with the Adhesive B-C layers suggests that sufficient BHTinhibitor was present in these adhesives to prevent or minimizecross-boundary cure from the Z100 cure. Subsequent irradiation with aVISILUX 2500 halogen light as described in Example 1 (Curing Method 2)did cause the Z100 layers to be adhered to the Adhesive B- and AdhesiveC-coated slides.

It is concluded from the results of this Example that the level of freeradical inhibitor in adhesive compositions based on phosphine oxidephotoinitiators may be important in achieving the intended results withsequentially cured restorative-adhesive procedures.

Example 5 Effect on Tooth Strain Following Selective Curing

Extracted human teeth (premolars) were cut with a MOD (mesial, occlusal,distal) preparation as well known in the dental field and strain gaugeswere attached to opposite sides of the tooth structures in order tomeasure tooth displacement during and following irradiation as detailedin the Tooth Strain Test Method described herein. The tooth samples wereprepared in a conventional manner by etching for 10-20 seconds withSCOTCHBOND phosphoric acid etchant and priming with SCOTCHBONDmulti-purpose primer. A thin coating of Adhesive B was then applied tothe prepared tooth cavities and subsequent steps were followed accordingto one of the following two protocols:

Standard (Conventional) Protocol: The adhesive-coated tooth cavity wasirradiated by exposure at 800 mw/cm2 for 20 seconds to an ELIPARTrilight (3M Company) having an effective wavelength range of about400-500 nm. The adhesive layer cured to a hard coating. The cavity wasthen filled with Z100 restorative and irradiated for 60 seconds with thesame light to cure the restorative.

Two-Wavelength Protocol: The adhesive-coated (uncured) tooth cavity wasfilled with Z100 restorative and the filled tooth irradiated by exposureat 800 mw/cm² for 60 seconds to an ELIPAR Trilight filtered with anOriel 51290 light filter (Oriel, Stratford, Conn.) having a 475-nmcutoff to afford an effective wavelength range of about 475-500 nm. Atthis wavelength range the restorative was cured, whereas the Adhesive Blayer was uncured. The Adhesive B layer was then cured by irradiatingthe filled tooth sample for 20 seconds with the ELIPAR Trilight absentthe Oriel filter.

For both the Standard and the Two-Wavelength Protocols, tooth strain vs.time was measured during curing and post-curing according to the ToothStrain Test Method described herein. Results in terms of “ultimatestrain” after 5 minutes from the start of the initial irradiation wasabout 200 microstrain for the Standard Protocol and about 50 microstrainfor the Two-Wave Protocol. Therefore, it can be concluded from theresults of this example that the Two-Wave Protocol provided a 75%reduction in tooth strain as compared to the Standard Protocol.

Example 6 Sequential Curing of Compositions with Different CureMechanisms

The objective of this example was to demonstrate the sequential cure ofan adhesive layer and subsequently applied composite layer utilizingdifferent cure methods, e.g., a chemical cure (self-cure) mechanism forthe composite layer followed by a photocure mechanism for the adhesivelayer.

Bovine tooth samples embedded in an acrylic resin were prepared with120-grit sandpaper such that a smooth and uniform enamel surface wasobtained. SCOTCHBOND phosphoric acid etchant (3M Company) was applied bybrush to groups of 5 teeth and allowed to reside on the surface of theteeth of about 15 seconds. The teeth were thoroughly rinsed with waterto remove excess etching gel and then dried with a stream of compressedair.

Teflon molds 2.5-mm thick and having cylindrical 4.7-mm diameter holesfitted with gelatin capsule sleeves were applied, centered, and clampeddirectly onto the etched enamel surfaces of the teeth. The light curableAdhesive I composition (containing IRGACURE 819 photoinitiator) wasapplied with a brush as a thin film layer to the enamel surfacesdirectly below the holes of each Teflon mold. A two-part, self-curing(i.e., chemically polymerizable using a redox cure system) compositematerial made from the Paste A and Paste B components listed in Table 3was then utilized as described in the following 3 curing methods. TABLE3 Components of Composite Material Composite Material Paste A Paste BComponent Parts by Wt. Component Parts by Wt. Bis-GMA 18.83 Bis-GMA18.16 TEGDMA 3.75 TEGDMA 3.63 BHT 0.13 DHEPT 0.53 BPO 0.029 TINUVIN P0.18 Quartz Fillers 77.00 Quartz Fillers 77.50

Curing Method 1. The coated adhesive layer was irradiated for 30 secondswith an XL 3000 Dental Curing Light (3M Company) having an effectivewavelength range of about 400-500 nm. The adhesive layer was therebycured to a hardened coating. Equal portions of Paste A and Paste B werethen mixed on a dental mixing pad until homogeneous and then incrementsof the resulting composite material were transferred to the holes in theTeflon molds until the molds were filled. The composite materialhardened to the touch within 3 minutes. The samples were allowed to curefor a total of 5 minutes and the entire molds then immersed in water at37° C. for 24 hours.

Curing Method 2. This method was identical to Curing Method 1, exceptthat the coated adhesive layer was not irradiated with light (i.e., wasleft uncured) before the composite material was added to the molds.

Curing Method 3. This method was identical to Curing Method 2, exceptthat directly following the 5-minute cure of the composite material, thesamples were irradiated for 30 seconds with an XL 3000 Dental CuringLight by applying the light in direct contact with the cured compositematerial. The samples were allowed to cure and the entire molds thenimmersed in water at 37° C. for 24 hours.

Five samples for each curing method were then evaluated for Shear BondStrength according to the test method described herein and the results(adhesion to enamel as an average of the 5 samples) were as follows:

Curing Method 1 Samples: 8.3±3.1 MPa

Curing Method 2 Samples: 1.9±2.3 MPa (4 out of the 5 samples exhibitedno adhesion)

Curing Method 3 Samples: 14.9±3.5 MPa

It can be concluded from these results that the greatest adhesion toenamel was achieved with Curing Method 3 in which the composite materialwas cured by way of a self-cure mechanism (i.e., chemicalpolymerization) followed by a light cure of the adhesive layer (i.e.,photopolymerization). This adhesion value (14.9±3.5 MPa) was nearlytwice the adhesion achieved with Curing Method 1 in which the adhesivelayer was cured by light before the addition and subsequent self-cure ofthe composite material. As expected, little or no adhesion was achievedwith Curing Method 2 in which the adhesive layer was uncured.

Comparative Example 1 Utilization of Red Photoinitiator with AbsorptionAbove 520 nm

The objective of this example was to demonstrate the physical properties(e.g., color) of sequentially cured layered compositions havingdifferent photoinitiator systems in different layers and having one ofthe photoinitiators capable of absorbing radiation at wavelengthsgreater than about 520 nm.

Compositions A (with Eosin Y, a red compound) and B (with CPQ) wereprepared by combining the components listed in Table 4. TABLE 4Components of Compositions A and B Composition A Composition B Component(Parts by Weight) (Parts by Weight) Bis-GMA/TEGDMA 9.89 9.5 (50/50Blend) MDEA  0.118 0.177 BME — 0.32 CPQ 0.03 — Eosin Y — 0.005Silane-treated quartz 40.15  40.01 filler

A TEFLON mold having a cylindrical hole (6.5-mm deep and 6.3-mmdiameter) was filled at the bottom (about 2-mm in thickness) withComposition B (having CPQ photosensitizer that absorbs radiation andpromotes cure at a wavelength range of 400 to about 500 nm) and at thetop (about 4.5-mm in thickness) with the pink Composition A (havingEosin Y photosensitizer that absorbs radiation and promotes cure at awavelength range of about 450 to about 570 nm). Two additional Teflonmolds were filled in the same manner. The first filled mold wasirradiated from the top for 10 seconds with a 100 W high pressure Hglight source (Lesco, Torrance, Calif.) with a light intensity in thevisible region in excess of 200 mW/cm2 and with the light filtered withan OG 515 long-pass glass filter (ESCO Products, Oak Ridge, N.J.) toprovide a wavelength range that begins at about 480 nm and typicallyreaches about 50% transmittance at about 515 nm. The first mold was thenirradiated from the top again for 10 seconds in the same manner, exceptthat an OG 400 long-pass filter (ESCO Products) was utilized to providea wavelength range that begins at about 380 nm and typically reachesabout 50% transmittance at about 400 nm. The second mold was irradiatedtwice in the same manner except that the irradiation times were both 20seconds and the third mold was irradiated twice in the same mannerexcept that the irradiation times were both 40 seconds.

For all 3 mold samples the top layer of Composition A hardened duringthe first irradiation with the OG 515 filter, but Composition B remaineduncured. Composition B then hardened during the second irradiation withthe OG 400 filter. In all cases the Composition A in the mold changedcolor from pink to yellow-orange following curing. In contrast, theComposition B in the mold remained a light yellow following curing.Significant coloring following curing would be generally unacceptable incertain practical applications, e.g., as dental fillings andrestorations.

The Barcol Hardness of the cured compositions was determined with aBarcol Hardness Tester (Model GYZJ 934-1, Barber-Colman Company, LovesPark, Ill.) used according to manufacturer's instructions and theresults are provided in Table 5. It can be concluded from the data inTable 5 that increasing the irradiation times from 10 to 40 seconds ledto a more complete cure (i.e., hardening) of the bottom compositionlayer, whereas the top layer was essentially completely cured at allirradiation times. TABLE 5 Barcol Hardness Results Irradiation BarcolHardness Units Teflon Times Top Layer Bottom Layer Mold (Seconds) (withEosin Y) (with CPQ) First 2 × 10 80 12-15 Second 2 × 20 85 60 Third 2 ×40 88 80

The complete disclosures of the patents, patent documents, andpublications cited herein are incorporated by reference in theirentirety as if each were individually incorporated. Variousmodifications and alterations to this invention will become apparent tothose skilled in the art without departing from the scope and spirit ofthis invention. It should be understood that this invention is notintended to be unduly limited by the illustrative embodiments andexamples set forth herein and that such examples and embodiments arepresented by way of example only with the scope of the inventionintended to be limited only by the claims set forth herein as follows.

1. A dental composition hardening light comprising: a housing; a firstlight source located within the housing, the first light source emittinglight in a first wavelength range; a second light source located withinthe housing, the second light source emitting light in a secondwavelength range; and a controller operably connected to the first lightsource and the second light source, the controller controlling emissionof light from the first light source and the second light source.
 2. Thelight of claim 1 wherein the first light source emits only light withinthe first wavelength range.
 3. The light of claim 1 wherein the firstlight source emits light with wavelengths outside of the firstwavelength range.
 4. The light of claim 1 wherein the first light sourceis capable of emitting light with wavelengths in both the firstwavelength range and the second wavelength range.
 5. The light of claim1 wherein the first wavelength range is about 380 nm to about 450 nm. 6.The light of claim 5 wherein the second wavelength range is about 450 nmto about 520 nm.
 7. The light of claim 5 wherein the first wavelengthrange is about 380 nm to about 520 nm.
 8. The light of claim 1 whereinthe first light source comprises a light-emitting diode.
 9. The light ofclaim 1 wherein the second light source comprises a light-emittingdiode.
 10. A process of hardening a dental composition comprisingapplying radiation from a light comprising: a housing; a first lightsource located within the housing, the first light source emitting lightin a first wavelength range; a second light source located within thehousing, the second light source emitting light in a second wavelengthrange; and a controller operably connected to the first light source andthe second light source, the controller controlling emission of lightfrom the first light source and the second light source.
 11. The processof claim 10 wherein the first light source is capable of emitting lightwith wavelengths in both the first wavelength range and the secondwavelength range.
 12. The process of claim 10 wherein the first lightsource comprises a light-emitting diode.
 13. The process of claim 10wherein the second light source comprises a light-emitting diode.